Learn All Stages of Phone Repair

Stage 1: basic part of phone repair

Learn the mobile phone motherboard components, mobile phone architecture, mobile phone circuit working principle analysis, software and hardware fault diagnosis and maintenance, as well as the operation and use of tools and equipment.

Teaching objectives

Master the basic knowledge of phone repair, master the working principle of the circuit of Apple's full range of mobile phones and Android mobile phones, quickly master the maintenance methods and skills of various common faults of apple and Android mobile phones, understand the detection / repair of new models and new faults, independently create phone repair stores, and directly face phone repair faults.

Stage II - phone repair theory

Basic theory of mobile phone, mobile phone brushing knowledge, mobile phone screen structure and fitting, basic circuit of mobile phone, display and backlight circuit, mobile phone touch, audio, charging, wifi/bt, fingerprint, sensor circuit principle analysis, shop opening and employment guidance courses, management courses.

Learning effect

It can independently solve various problems of apple, Huawei, Xiaomi, Samsung, LG and other mobile phones, such as burst screen, broken screen, water ingress, no sound, poor touch control, no power on and so on; The problem of mobile phone can be determined through detection, and mainboard circuit maintenance can be carried out; You can open a store independently to solve the motherboard problems that other peers cannot solve.

Stage 3 - phone repair practice

The usage of voltage stabilizing source and multimeter, the disassembly and assembly methods and skills of mobile phones, the brushing method of mobile phones, the actual operation of pressing screen, and the voltage signal measured on the motherboard.

 

Stage 4 - phone repair manual part

Soldering iron and hot air gun welding method, chip prying, glue cleaning and welding, point digging and flying wire, fingerprint flying wire, screw hole flying wire, broken board wiring, capacity expansion, hard solution ID, CPU disassembly and assembly.